Gigabyte b660m gaming x ddr4 мануал

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Summary of Contents for Gigabyte B660 GAMING X

For more product details,

please visit GIGABYTE’s

website.

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B660M GAMING X AX

B660M GAMING X

B660M G X AX DDR4

(B660M GAMING X AX DDR4)

B660M GAMING X DDR4

User’s Manual

Rev. 1101

B660M GAMING X

AX

B660M GAMING X B660M G X AX

DDR4

B660M GAMING X

DDR4

Copyright

© 2022 GIGA-BYTE TECHNOLOGY CO., LTD. All rights reserved.

The trademarks mentioned in this manual are legally registered to their respective owners.

Disclaimer

Information in this manual is protected by copyright laws and is the property of GIGABYTE.

Changes to the specications and features in this manual may be made by GIGABYTE without

prior notice. No part of this manual may be reproduced, copied, translated, transmitted, or

published in any form or by any means without GIGABYTE’s prior written permission.

In order to assist in the use of this product, carefully read the User’s Manual.

For product-related information, check on our website at: https://www.gigabyte.com

Identifying Your Motherboard Revision

The revision number on your motherboard looks like this: «REV: X.X.» For example, «REV: 1.0»

means the revision of the motherboard is 1.0. Check your motherboard revision before updating

motherboard BIOS, drivers, or when looking for technical information.

Example:

— 3 —

Table of Contents

Chapter 1 Product Introduction ……………………………………………………………………………4

1-1 Motherboard Layout …………………………………………………………………………….. 4

1-2 Box Contents ………………………………………………………………………………………. 6

Chapter 2 Hardware Installation ………………………………………………………………………….7

2-1 Installation Precautions ………………………………………………………………………… 7

2-2 Product Specications ………………………………………………………………………….. 8

2-3 Installing the CPU and CPU Cooler ……………………………………………………… 12

2-4 Installing the Memory …………………………………………………………………………. 15

2-5 Installing an Expansion Card ………………………………………………………………. 16

2-6 Back Panel Connectors ………………………………………………………………………. 17

2-7 Internal Connectors ……………………………………………………………………………. 19

Chapter 3 BIOS Setup ……………………………………………………………………………………..31

Chapter 4 Installing the Operating System and Drivers ………………………………………… 33

4-1 Operating System Installation ……………………………………………………………… 33

4-2 Drivers Installation ……………………………………………………………………………… 34

Chapter 5 Appendix …………………………………………………………………………………………35

5-1 Conguring a RAID Set ………………………………………………………………………. 35

Regulatory Notices ………………………………………………………………………………………. 36

Contact Us …………………………………………………………………………………………………. 39

— 4 —

1-1 Motherboard Layout

Chapter 1 Product Introduction

Temperature sensor

j Only for B660M GAMING X AX.

R_USB20_1 CPU_FAN

SYS_FAN1

ATX

B660M GAMING X AX

B660M GAMING X

F_AUDIO

SPDIF_O

AUDIO

BAT

ATX_12V_2X4

CODEC RST

U32_LAN

PCIEX16

iTE®

Super I/O

2.5 GbE LAN

LED_C1 F_USB1

SYS_FAN3

SPI_TPM F_PANEL

SATA3 7

6

M2_WIFIj

80

60

60

80

M_BIOS

QFLASH_PLUS

RST_SW

F_U32C

U32_USB20

M2P_SB

M2A_CPU

DDR5_A2

DDR5_A1

DDR5_B1

DDR5_B2

D_LED1

F_USB2

QFLED

DP_HDMI20

COM

USB 2.0 Hub

LGA1700

Intel® B660

PCIEX4

THB_C1

THB_C2 SATA3 4 5

USB 2.0 Hub

D_LED2

LED_C2

F_U32

R_USB20_2

110

CLR_CMOS

SYS_FAN2

— 5 —

Temperature sensor

l Only for B660M G X AX DDR4.

R_USB20_1 CPU_FAN

SYS_FAN1

ATX

B660M G X AX DDR4

B660M GAMING X DDR4

F_AUDIO

SPDIF_O

AUDIO

BAT

ATX_12V_2X4

CODEC RST

U32_LAN

PCIEX16

iTE®

Super I/O

2.5 GbE LAN

LED_C1 F_USB1

SYS_FAN3

SPI_TPM F_PANEL

SATA3 7

6

M2_WIFIl

80

60

60

80

M_BIOS

QFLASH_PLUS

RST_SW

F_U32C

U32_USB20

M2P_SB

M2A_CPU

DDR4_A2

DDR4_A1

DDR4_B1

DDR4_B2

D_LED1

SYS_FAN2

F_USB2

QFLED

DP_HDMI20

COM

USB 2.0 Hub

LGA1700

Intel® B660

PCIEX4

THB_C1

THB_C2 SATA3 4 5

USB 2.0 Hub

D_LED2

LED_C2

F_U32

R_USB20_2

110

CLR_CMOS

— 6 —

1-2 Box Contents

5B660M GAMING X AX, B660M GAMING X, B660M G X AX DDR4, or

B660M GAMING X DDR4 motherboard

5User’s Manual

5Two SATA cables

5One antennajl

5M.2 screw(s)/M.2 standoff(s)

* The box contents above are for reference only and the actual items shall depend on the product package you obtain.

The box contents are subject to change without notice.

j Only for B660M GAMING X AX.

l Only for B660M G X AX DDR4.

— 7 —

2-1 Installation Precautions

The motherboard contains numerous delicate electronic circuits and components which can become

damaged as a result of electrostatic discharge (ESD). Prior to installation, carefully read the user’s

manual and follow these procedures:

•Prior to installation, make sure the chassis is suitable for the motherboard.

•Prior to installation, do not remove or break motherboard S/N (Serial Number) sticker or

warranty sticker provided by your dealer. These stickers are required for warranty validation.

•Always remove the AC power by unplugging the power cord from the power outlet before

installing or removing the motherboard or other hardware components.

•When connecting hardware components to the internal connectors on the motherboard, make

sure they are connected tightly and securely.

•When handling the motherboard, avoid touching any metal leads or connectors.

•It is best to wear an electrostatic discharge (ESD) wrist strap when handling electronic

components such as a motherboard, CPU or memory. If you do not have an ESD wrist strap,

keep your hands dry and rst touch a metal object to eliminate static electricity.

•Prior to installing the motherboard, please have it on top of an antistatic pad or within an

electrostatic shielding container.

•Before connecting or unplugging the power supply cable from the motherboard, make sure

the power supply has been turned off.

•Before turning on the power, make sure the power supply voltage has been set according to

the local voltage standard.

•Before using the product, please verify that all cables and power connectors of your hardware

components are connected.

•To prevent damage to the motherboard, do not allow screws to come in contact with the

motherboard circuit or its components.

•Make sure there are no leftover screws or metal components placed on the motherboard or

within the computer casing.

•Do not place the computer system on an uneven surface.

•Do not place the computer system in a high-temperature or wet environment.

•Turning on the computer power during the installation process can lead to damage to system

components as well as physical harm to the user.

•If you are uncertain about any installation steps or have a problem related to the use of the

product, please consult a certied computer technician.

•If you use an adapter, extension power cable, or power strip, ensure to consult with its

installation and/or grounding instructions.

Chapter 2 Hardware Installation

— 8 —

2-2 ProductSpecications

CPU LGA1700 socket: Support for 12th Generation Intel® Core™, Pentium® Gold and

Celeron® Processors

(Go to GIGABYTE’s website for the latest CPU support list.)

L3 cache varies with CPU

Chipset Intel® B660 Express Chipset

Memory Support for DDR5 4800/4000 MHz memory modulesjk

Support for DDR4 3200/3000/2933/2666/2400/2133 MHz memory moduleslm

 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity)

of system memory

Dual channel memory architecture

 Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in

non-ECC mode)

Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules

Support for Extreme Memory Prole (XMP) memory modules

(Go to GIGABYTE’s website for the latest supported memory speeds and memory

modules.)

Onboard

Graphics

Integrated Graphics Processor-Intel® HD Graphics support:

— 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz

* Support for HDMI 2.0 version and HDCP 2.3.

— 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz

* Support for DisplayPort 1.2 version and HDCP 2.3

(Graphics specications may vary depending on CPU support.)

Audio Realtek® Audio CODEC

High Denition Audio

2/4/5.1/7.1-channel

* To congure 7.1-channel audio, you need to open the audio software and select

Device advanced settings > Playback Device to change the default setting rst.

Please visit GIGABYTE’s website for details on conguring the audio software.

Support for S/PDIF Out

LAN 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)

Wireless

Communication

Modulej

Intel® Wi-Fi 6E AX211 (For PCB rev. 1.0)

— WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands

— BLUETOOTH 5.2

— Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

* Actual data rate may vary depending on environment and equipment.

Wireless

Communication

Modulel

Intel® Wi-Fi 6 AX200 (For PCB rev. 1.0)

— WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band

— BLUETOOTH 5.2

— Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

Intel® Wi-Fi 6E AX211 (For PCB rev. 1.1)

— WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands

— BLUETOOTH 5.2

— Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

* Actual data rate may vary depending on environment and equipment.

j Only for B660M GAMING X AX. k Only for B660M GAMING X.

l Only for B660M G X AX DDR4. m Only for B660M GAMING X DDR4.

— 9 —

Expansion Slots 1 x PCI Express x16 slot, running at x16 (PCIEX16)

* For optimum performance, if only one PCI Express graphics card is to be installed,

be sure to install it in the PCIEX16 slot.

(The PCIEX16 slot conforms to PCI Express 4.0 standard.)

1 x PCI Express x16 slot, running at x4 (PCIEX4)

(The PCIEX4 slot conforms to PCI Express 3.0 standard.)

Multi-Graphics

Technology Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies

Storage Interface CPU:

— 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD

support) (M2A_CPU)

Chipset:

— 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2

SSD support) (M2P_SB)

— 4 x SATA 6Gb/s connectors

Support for SATA RAID 0, RAID 1, RAID 5, and RAID 10

Intel® Optane™ Memory Ready

* System acceleration with Intel® Optane™ Memory can only be enabled on the M.2

connector supported by the Chipset.

USB Chipset:

— 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the

internal USB header

— 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available

through the internal USB header)

— 1 x USB 2.0/1.1 port on the back panel

Chipset+2 USB 2.0 Hubs:

— 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through

the internal USB headers)

Internal

Connectors

1 x 24-pin ATX main power connector

1 x 8-pin ATX 12V power connector

1 x CPU fan header

3 x system fan headers

2 x addressable LED strip headers

2 x RGB LED strip headers

2 x M.2 Socket 3 connectors

4 x SATA 6Gb/s connectors

1 x front panel header

1 x front panel audio header

1 x USB Type-C® header, with USB 3.2 Gen 2 support

1 x USB 3.2 Gen 1 header

2 x USB 2.0/1.1 headers

1 x S/PDIF Out header

2 x Thunderbolt™ add-in card connectors

— 10 —

Internal

Connectors

 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI

2.0 module only)

1 x serial port header

1 x reset button

1 x Q-Flash Plus button

1 x reset jumper

1 x Clear CMOS jumper

Back Panel

Connectors

3 x USB 3.2 Gen 1 ports

5 x USB 2.0/1.1 ports

2 x SMA antenna connectors (2T2R)jl

1 x HDMI 2.0 port

1 x DisplayPort

1 x RJ-45 port

3 x audio jacks

I/O Controller iTE® I/O Controller Chip

Hardware

Monitor

Voltage detection

Temperature detection

Fan speed detection

Fan fail warning

Fan speed control

* Whether the fan speed control function is supported will depend on the fan you install.

BIOS 1 x 256 Mbit ash

Use of licensed AMI UEFI BIOS

PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Unique Features Support for APP Center

* Available applications in APP Center may vary by motherboard model. Supported

functions of each application may also vary depending on motherboard specications.

— @BIOS

— EasyTune

— Fast Boot

— Game Boost

— ON/OFF Charge

— RGB Fusion

— Smart Backup

— System Information Viewer

Support for Q-Flash Plus

Support for Q-Flash

Support for Xpress Install

j Only for B660M GAMING X AX.

l Only for B660M G X AX DDR4.

— 11 —

Please visit GIGABYTE’s website for

support lists of CPU, memory modules,

SSDs, and M.2 devices.

Please visit the SupportUtility List page on GIGABYTE’s website to download the latest

version of apps.

Bundled

Software

Norton® Internet Security (OEM version)

LAN bandwidth management software

Operating

System

Support for Windows 11 64-bit

Support for Windows 10 64-bit

Form Factor Micro ATX Form Factor; 24.4cm x 24.4cm

* GIGABYTE reserves the right to make any changes to the product specications and product-related information without

prior notice.

B660M GAMING X

AX

B660M GAMING X B660M G X AX

DDR4

B660M GAMING X

DDR4

— 12 —

2-3 Installing the CPU and CPU Cooler

Read the following guidelines before you begin to install the CPU:

•Make sure that the motherboard supports the CPU.

(Go to GIGABYTE’s website for the latest CPU support list.)

•Always turn off the computer and unplug the power cord from the power outlet before installing the

CPU to prevent hardware damage.

•Locate the pin one of the CPU. The CPU cannot be inserted if oriented incorrectly. (Or you may

locate the notches on both sides of the CPU and alignment keys on the CPU socket.)

•Apply an even and thin layer of thermal grease on the surface of the CPU.

•Do not turn on the computer if the CPU cooler is not installed, otherwise overheating and damage

of the CPU may occur.

•Set the CPU host frequency in accordance with the CPU specications. It is not recommended

that the system bus frequency be set beyond hardware specications since it does not meet the

standard requirements for the peripherals. If you wish to set the frequency beyond the standard

specications, please do so according to your hardware specications including the CPU, graphics

card, memory, hard drive, etc.

A. Note the CPU Orientation

Note the alignment keys on the motherboard CPU socket and the notches on the CPU.

Please visit GIGABYTE’s website for details on hardware installation.

Do not remove the CPU socket cover before inserting the CPU. It may pop off from the load

plate automatically after you insert the CPU and close the load plate.

Notch

Notch

LGA1700 CPU

Triangle Pin One Marking

on the CPU

Alignment Key

LGA1700 CPU Socket

Triangle Pin One Marking

of the CPU Socket

Alignment Key

— 13 —

Do not force to engage the CPU socket locking lever when the CPU is not installed correctly

as this would damage the CPU and CPU socket.

B. Installing the CPU

Follow the steps below to correctly install the CPU into the motherboard CPU socket.

w

u

v

jGently press the CPU socket lever handle

down and away from the socket.

kCompletely lift up the CPU socket lock—

ing lever.

lUse the finger tab on the side of the

metal load plate to lift open the metal

load plate with the plastic protective cover

attached to it.

Hold the CPU with your ngers by the edges.

Align the CPU pin one marking (triangle) with

the pin one corner of the CPU socket (or you

may align the CPU notches with the socket

alignment keys) and gently insert the CPU

into position.

Make sure the CPU is properly installed and

then close the load plate. The plastic protec-

tive cover will pop off, just remove it. Secure

the lever under its retention tab to complete

the installation of the CPU.

* Always replace the plastic protective cover

when the CPU is not installed to protect the

CPU socket.

j

k

l

Finger Tab

Pin One

j

k

l

— 14 —

C. Installing the CPU Cooler

Be sure to install the CPU cooler after installing the CPU. (Actual installation process may differ depending the

CPU cooler to be used. Refer to the user’s manual for your CPU cooler.)

u

v

Apply an even and thin layer of thermal

grease on the surface of the installed CPU.

Place the cooler atop the CPU, aligning the

four push pins through the pin holes on the

motherboard. Push down on the push pins

diagonally.

j

j

kk

w

Finally, attach the power connector of

the CPU cooler to the CPU fan header

(CPU_FAN) on the motherboard.

CPU_FAN

— 15 —

2-4 Installing the Memory

Read the following guidelines before you begin to install the memory:

•Make sure that the motherboard supports the memory. It is recommended that memory of the same

capacity, brand, speed, and chips be used. (Go to GIGABYTE’s website for the latest supported

memory speeds and memory modules.)

•Always turn off the computer and unplug the power cord from the power outlet before installing the

memory to prevent hardware damage.

•Memory modules have a foolproof design. A memory module can be installed in only one direction.

If you are unable to insert the memory, switch the direction.

DualChannelMemoryConguration

This motherboard provides four memory sockets and supports Dual Channel Technology. After the memory

is installed, the BIOS will automatically detect the specications and capacity of the memory. Enabling Dual

Channel memory mode will double the original memory bandwidth.

The four memory sockets are divided into two channels and each channel has two memory sockets as following:

Channel A: DDR5_A1jk/DDR4_A1lm, DDR5_A2jk/DDR4_A2lm

Channel B: DDR5_B1jk/DDR4_B1lm, DDR5_B2jk/DDR4_B2lm

* Recommended Dual Channel Memory Conguration:

DDR5_A1jk

DDR4_A1lm

DDR5_A2jk

DDR4_A2lm

DDR5_B1jk

DDR4_B1lm

DDR5_B2jk

DDR4_B2lm

2 Modules — — DS/SS — — DS/SS

4 Modules DS/SS DS/SS DS/SS DS/SS

(SS=Single-Sided, DS=Double-Sided, «- -«=No Memory)

Due to CPU limitations, read the following guidelines before installing the memory in Dual Channel mode.

1. Dual Channel mode cannot be enabled if only one memory module is installed.

2. When enabling Dual Channel mode with two or four memory modules, it is recommended that memory of

the same capacity, brand, speed, and chips be used.

When installing a single memory module, we recommend that you install it in the DDR5_A2jk/

DDR4_A2lm or DDR5_B2jk/DDR4_B2lm socket.

DDR5_A1jk/DDR4_A1lm

DDR5_A2jk/DDR4_A2lm

DDR5_B1jk/DDR4_B1lm

DDR5_B2jk/DDR4_B2lm

j Only for B660M GAMING X AX.

k Only for B660M GAMING X.

l Only for B660M G X AX DDR4.

m Only for B660M GAMING X DDR4.

— 16 —

2-5 Installing an Expansion Card

Read the following guidelines before you begin to install an expansion card:

•Make sure the motherboard supports the expansion card. Carefully read the manual that came

with your expansion card.

•Always turn off the computer and unplug the power cord from the power outlet before installing an

expansion card to prevent hardware damage.

Follow the steps below to correctly install your expansion card in the expansion slot.

1. Locate an expansion slot that supports your card. Remove the metal slot cover from the chassis back panel.

2. Align the card with the slot, and press down on the card until it is fully seated in the slot.

3. Make sure the metal contacts on the card are completely inserted into the slot.

4. Secure the card’s metal bracket to the chassis back panel with a screw.

5. After installing all expansion cards, replace the chassis cover(s).

6. Turn on your computer. If necessary, go to BIOS Setup to make any required BIOS changes for your

expansion card(s).

7. Install the driver provided with the expansion card in your operating system.

PCIEX16 Slot

— 17 —

2-6 Back Panel Connectors

USB 2.0/1.1 Port

The USB port supports the USB 2.0/1.1 specication. Use this port for USB devices.

SMA Antenna Connectors (2T2R)jl

Use this connector to connect an antenna.

DisplayPort

DisplayPort delivers high quality digital imaging and audio, supporting bi-directional audio transmission.

DisplayPort can support HDCP 2.3 content protection mechanisms. You can use this port to connect your

DisplayPort-supported monitor. Note: The DisplayPort Technology can support a maximum resolution of

4096×2304@60 Hz but the actual resolutions supported depend on the monitor being used.

HDMI 2.0 Port

The HDMI port supports HDCP 2.3 and Dolby TrueHD and DTS HD Master

Audio formats. It also supports up to 192KHz/24bit 7.1-channel LPCM audio

output. You can use this port to connect your HDMI-supported monitor. The maximum supported

resolution is 4096×2160@60 Hz, but the actual resolutions supported are dependent on the monitor

being used.

After installing the HDMI/DisplayPort device, make sure to set the default sound playback device

to HDMI/DisplayPort. (The item name may differ depending on your operating system.)

(Note) To enable the Q-Flash Plus function, please navigate to the «Unique Features» page of GIGABYTE’s

website for more information.

Tighten the antennas to the antenna connectors and then aim the antennas correctly for better

signal reception.

USB 3.2 Gen 1 Port

The USB 3.2 Gen 1 port supports the USB 3.2 Gen 1 specication and is compatible to the USB 2.0

specication. Use this port for USB devices.

USB 2.0/1.1 Port (Q-Flash Plus Port)

The USB port supports the USB 2.0/1.1 specication. Use this port for USB devices. Use this port for USB

devices. Before using Q-Flash Plus (Note), make sure to insert the USB ash drive into this port rst.

j Only for B660M GAMING X AX.

l Only for B660M G X AX DDR4.

— 18 —

Please visit GIGABYTE’s website for details on conguring the audio software.

•When removing the cable connected to a back panel connector, rst remove the cable from

your device and then remove it from the motherboard.

•When removing the cable, pull it straight out from the connector. Do not rock it side to side

to prevent an electrical short inside the cable connector.

Audio Jack Congurations:

Jack Headphone/

2-channel 4-channel 5.1-channel 7.1-channel

Line Out/Front Speaker Out a a a a

Mic In/Rear Speaker Out a a a

Front Panel Line Out/Side Speaker Out a

Front Panel Mic In/Center/Subwoofer

Speaker Out a a

•You can change the functionality of an audio jack using the audio software.

•To congure 7.1-channel audio, you need to open the audio software and select Device

advanced settings > Playback Device to change the default setting rst.

Activity LEDSpeed LED

LAN Port

Speed LED:

State Description

Green 2.5 Gbps data rate

Orange 1 Gbps data rate

Off 100 Mbps data rate

Activity LED:

State Description

Blinking Data transmission or receiving is occurring

On No data transmission or receiving is occurring

RJ-45 LAN Port

The Gigabit Ethernet LAN port provides Internet connection at up to 2.5 Gbps data rate. The following

describes the states of the LAN port LEDs.

Line Out/Front Speaker Out

The line out jack.

Mic In/Rear Speaker Out

The Mic in jack.

Optical S/PDIF Out Connector

This connector provides digital audio out to an external audio system that supports digital optical audio.

Before using this feature, ensure that your audio system provides an optical digital audio in connector.

Realtek® 2.5GbE LAN chip:

Intel® 2.5GbE LAN chip:

Activity LED

Speed LED

LAN Port

Speed LED:

State Description

Orange 2.5 Gbps data rate

Green 1 Gbps data rate

Off 100 Mbps data rate

Activity LED:

State Description

Blinking Data transmission or receiving is occurring

Off No data transmission or receiving is occurring

— 19 —

2-7 Internal Connectors

Read the following guidelines before connecting external devices:

•First make sure your devices are compliant with the connectors you wish to connect.

•Before installing the devices, be sure to turn off the devices and your computer. Unplug the power

cord from the power outlet to prevent damage to the devices.

•After installing the device and before turning on the computer, make sure the device cable has

been securely attached to the connector on the motherboard.

1) ATX_12V_2X4

2) ATX

3) CPU_FAN

4) SYS_FAN1/2/3

5) LED_C1/LED_C2

6) D_LED1/D_LED2

7) SATA3 4/5/6/7

M2A_CPU/M2P_SB

9) F_PANEL

10) F_AUDIO

11) F_U32C

12) F_U32

13) F_USB1/F_USB2

14) SPI_TPM

15) COM

16) THB_C1/THB_C2

17) SPDIF_O

18) BAT

19) CLR_CMOS

20) RST_SW/RST

21) QFLASH_PLUS

9

11

2

5

12

7

13515

61

7

3

8

4

4lm

4

16 21146

8

17

10

18

19

20

4jk

j Only for B660M GAMING X AX.

k Only for B660M GAMING X.

l Only for B660M G X AX DDR4.

m Only for B660M GAMING X DDR4.

— 20 —

1/2) ATX_12V_2X4/ATX (2×4 12V Power Connectors and 2×12 Main Power Connector)

With the use of the power connector, the power supply can supply enough stable power to all the components

on the motherboard. Before connecting the power connector, rst make sure the power supply is turned

off and all devices are properly installed. The power connector possesses a foolproof design. Connect the

power supply cable to the power connector in the correct orientation.

The 12V power connector mainly supplies power to the CPU. If the 12V power connector is not connected,

the computer will not start.

To meet expansion requirements, it is recommended that a power supply that can withstand high

power consumption be used (500W or greater). If a power supply is used that does not provide the

required power, the result can lead to an unstable or unbootable system.

ATX_12V_2X4

ATX:

Pin No. Denition Pin No. Denition

1 3.3V 13 3.3V

2 3.3V 14 -12V

3 GND 15 GND

4 +5V 16 PS_ON (soft On/Off)

5 GND 17 GND

6 +5V 18 GND

7 GND 19 GND

8 Power Good 20 NC

9 5VSB (stand by +5V) 21 +5V

10 +12V 22 +5V

11 +12V (Only for 2×12-pin

ATX)

23 +5V (Only for 2×12-pin ATX)

12 3.3V (Only for 2×12-pin

ATX)

24 GND (Only for 2×12-pin ATX)

41

85

131

24

12

ATX

ATX_12V_2X4:

Pin No. Denition Pin No. Denition

1GND (Only for 2×4-pin 12V) 5 +12V (Only for 2×4-pin 12V)

2GND (Only for 2×4-pin 12V) 6 +12V (Only for 2×4-pin 12V)

3 GND 7 +12V

4 GND 8 +12V

— 21 —

•Be sure to connect fan cables to the fan headers to prevent your CPU and system from

overheating. Overheating may result in damage to the CPU or the system may hang.

•These fan headers are not conguration jumper blocks. Do not place a jumper cap on the headers.

3/4) CPU_FAN/SYS_FAN1/2/3 (Fan Headers)

All fan headers on this motherboard are 4-pin. Most fan headers possess a foolproof insertion design.

When connecting a fan cable, be sure to connect it in the correct orientation (the black connector wire is

the ground wire). The speed control function requires the use of a fan with fan speed control design. For

optimum heat dissipation, it is recommended that a system fan be installed inside the chassis.

Pin No. Denition

1 GND

2 Voltage Speed Control

3 Sense

4 PWM Speed Control

CPU_FAN

1

1

SYS_FAN3

1

SYS_FAN1/SYS_FAN2

Connector CPU_FAN SYS_FAN1~3

Maximum Current 2A 2A

Maximum Power 24W 24W

5) LED_C1/LED_C2 (RGB LED Strip Headers)

The headers can be used to connect a standard 5050 RGB LED strip (12V/G/R/B), with maximum power

rating of 2A (12V) and maximum length of 2m.

Connect your RGB LED strip to the header. The power pin (marked with a

triangle on the plug) of the LED strip must be connected to Pin 1 (12V) of

this header. Incorrect connection may lead to the damage of the LED strip.

Pin No. Denition

1 12V

2 G

3 R

4 B

1

LED_C2

1

LED_C1

RGB LED Strip

1

12V

Before installing the devices, be sure to turn off the devices and your computer. Unplug the power

cord from the power outlet to prevent damage to the devices.

For how to turn on/off the lights of the LED strip, please navigate to the «Unique Features» page

of GIGABYTE’s website.

— 22 —

6) D_LED1/D_LED2 (Addressable LED Strip Headers)

The headers can be used to connect a standard 5050 addressable LED strip, with maximum power rating

of 5A (5V) and maximum number of 1000 LEDs.

Before installing the devices, be sure to turn off the devices and your computer. Unplug the power

cord from the power outlet to prevent damage to the devices.

For how to turn on/off the lights of the LED strip, please navigate to the «Unique Features» page

of GIGABYTE’s website.

1

D_LED1

Pin No. Denition

1 V (5V)

2 Data

3 No Pin

4 GND

Connect your addressable LED strip to the header. The power pin (marked

with a triangle on the plug) of the LED strip must be connected to Pin 1 of

the addressable LED strip header. Incorrect connection may lead to the

damage of the LED strip.

1

D_LED2

Addressable LED

Strip

1

7) SATA3 4/5/6/7 (SATA 6Gb/s Connectors)

The SATA connectors conform to SATA 6Gb/s standard and are compatible with SATA 3Gb/s and SATA 1.5Gb/s

standard. Each SATA connector supports a single SATA device. The Intel® Chipset supports RAID 0, RAID 1,

RAID 5, and RAID 10. Please navigate to the «Conguring a RAID Set» page of GIGABYTE’s website for

instructions on conguring a RAID array.

Pin No. Denition

1 GND

2 TXP

3 TXN

4 GND

5 RXN

6 RXP

7 GND

To enable hot-plugging for the SATA ports, please navigate to the «BIOS Setup» page of GIGABYTE’s

website and search for «SATA Conguration» for more information.

SATA3

1

1

7

7

7

6

71

SATA3 4 5

— 23 —

M2A_CPU/M2P_SB (M.2 Socket 3 Connectors)

The M.2 connectors on the motherboard support only M.2 PCIe SSDs.

Follow the steps below to correctly install an M.2 SSD in the M.2 connector.

Step 1:

Locate the M.2 connector where you will install the M.2 SSD, use a screwdriver to unfasten the screw on

the heatsink and then remove the heatsink. (Only the M2A_CPU connector has the heatsink)

Step 2:

Locate the proper mounting hole based on the length of your M.2 SSD drive. If needed, move the standoff

to the desired mounting hole. Insert the M.2 SSD into the M.2 connector at an angle.

Step 3:

Press the M.2 SSD down and then use the included screw to secure it in the connector. Remove the

protective lm from the bottom of the heatsink. Then replace the heatsink and secure it to the original hole.

* Types of M.2 SSDs supported by each M.2 connector:

M.2 PCIe x4 SSD M.2 PCIe x2 SSD M.2 SATA SSD

M2A_CPU a a r

M2P_SB a a r

M2P_SB

80110 60

80

60

M2A_CPU

— 24 —

The front panel design may differ by chassis. A front panel module mainly consists of power switch,

reset switch, power LED, hard drive activity LED, speaker and etc. When connecting your chassis

front panel module to this header, make sure the wire assignments and the pin assignments are

matched correctly.

9) F_PANEL (Front Panel Header)

Connect the power switch, reset switch, speaker, chassis intrusion switch/sensor and system status indicator

on the chassis to this header according to the pin assignments below. Note the positive and negative pins

before connecting the cables.

•PW (Power Switch):

Connects to the power switch on the chassis front panel. You may congure the way to turn off your

system using the power switch (please navigate to the «BIOS Setup» page of GIGABYTE’s website and

search for «Soft-Off by PWR-BTTN» for more information).

•SPEAK (Speaker):

Connects to the speaker on the chassis front panel. The system reports system startup status by issuing

a beep code. One single short beep will be heard if no problem is detected at system startup.

•HD (Hard Drive Activity LED):

Connects to the hard drive activity LED on the chassis front panel. The LED is on when the hard drive

is reading or writing data.

•RES (Reset Switch):

Connects to the reset switch on the chassis front panel. Press the reset switch to restart the computer

if the computer freezes and fails to perform a normal restart.

•CI (Chassis Intrusion Header):

Connects to the chassis intrusion switch/sensor on the chassis that can detect if the chassis cover has

been removed. This function requires a chassis with a chassis intrusion switch/sensor.

•NC: No connection.

•PLED/PWR_LED (Power LED):

Connects to the power status indicator on the chassis front panel. The LED

is on when the system is operating. The LED is off when the system is in S3/

S4 sleep state or powered off (S5).

System Status LED

S0 On

S3/S4/S5 Off

NC

NC

Power LED

1

2

19

20

CI-

CI+

PWR_LED-

PWR_LED+

PLED-

PW-

SPEAK+

SPEAK-

PLED+

PW+

Power LED

HD-

RES+

HD+

RES-

Hard Drive

Activity LED

Reset

Switch Chassis Intrusion

Header

Power Switch Speaker

PWR_LED-

— 25 —

10) F_AUDIO (Front Panel Audio Header)

The front panel audio header supports High Denition audio (HD). You may connect your chassis front

panel audio module to this header. Make sure the wire assignments of the module connector match the

pin assignments of the motherboard header. Incorrect connection between the module connector and the

motherboard header will make the device unable to work or even damage it.

Some chassis provide a front panel audio module that has separated connectors on each wire

instead of a single plug. For information about connecting the front panel audio module that has

different wire assignments, please contact the chassis manufacturer.

11) F_U32C (USB Type-C® Header with USB 3.2 Gen 2 Support)

The header conforms to USB 3.2 Gen 2 specication and can provide one USB port.

Pin No. Denition Pin No. Denition

1 VBUS 11 VBUS

2 TX1+ 12 TX2+

3 TX1- 13 TX2-

4 GND 14 GND

5 RX1+ 15 RX2+

6 RX1- 16 RX2-

7 VBUS 17 GND

8 CC1 18 D-

9 SBU1 19 D+

10 SBU2 20 CC2

20

10 11

1

1

2

9

10

Pin No. Denition

1 MIC L

2 GND

3 MIC R

4 NC

5 Head Phone R

6 MIC Detection

7 SENSE_SEND

8 No Pin

9 Head Phone L

10 Head Phone Detection

— 26 —

12) F_U32 (USB 3.2 Gen 1 Header)

The header conforms to USB 3.2 Gen 1 and USB 2.0 specication and can provide two USB ports. For

purchasing the optional 3.5″ front panel that provides two USB 3.2 Gen 1 ports, please contact the local

dealer.

Pin No. Denition Pin No. Denition

1 VBUS 11 D2+

2 SSRX1- 12 D2-

3 SSRX1+ 13 GND

4 GND 14 SSTX2+

5 SSTX1- 15 SSTX2-

6SSTX1+ 16 GND

7 GND 17 SSRX2+

8 D1- 18 SSRX2-

9 D1+ 19 VBUS

10 NC 20 No Pin

20 1

10

11

13) F_USB1/F_USB2 (USB 2.0/1.1 Headers)

The headers conform to USB 2.0/1.1 specication. Each USB header can provide two USB ports via an

optional USB bracket. For purchasing the optional USB bracket, please contact the local dealer.

Pin No. Denition

1 Power (5V)

2 Power (5V)

3 USB DX-

4 USB DY—

5 USB DX+

6 USB DY+

7 GND

8 GND

9 No Pin

10 NC

•Do not plug the IEEE 1394 bracket (2×5-pin) cable into the USB 2.0/1.1 header.

•Prior to installing the USB bracket, be sure to turn off your computer and unplug the power cord

from the power outlet to prevent damage to the USB bracket.

10

9

2

1

— 27 —

Pin No. Denition

1Data Output

2Power (3.3V)

3No Pin

4NC

5Data Input

6CLK

7Chip Select

8GND

9IRQ

10 NC

11 NC

12 RST

14) SPI_TPM (Trusted Platform Module Header)

You may connect an SPI TPM (Trusted Platform Module) to this header.

15) COM (Serial Port Header)

The COM header can provide one serial port via an optional COM port cable. For purchasing the optional

COM port cable, please contact the local dealer.

Pin No. Denition

1 NDCD-

2 NSIN

3 NSOUT

4 NDTR-

5 GND

6 NDSR-

7 NRTS-

8 NCTS-

9 NRI-

10 No Pin

12

11

2

1

10

9

2

1

— 28 —

16) THB_C1/THB_C2 (Thunderbolt™ Add-in Card Connectors)

The connectors are used to connect to a GIGABYTE Thunderbolt™ add-in card.

Supports a Thunderbolt™ add-in card.

1

1

THB_C2

THB_C1

17) SPDIF_O (S/PDIF Out Header)

This header supports S/PDIF digital output, which allows you to connect a S/PDIF digital audio cable to

output digital audio from your motherboard to the supported audio devices. For information about connecting

the digital audio cable, carefully read the manual for your audio devices.

Pin No. Denition

1 5VDUAL

2 No Pin

3 SPDIFO

4 GND

1

— 29 —

18) BAT (Battery)

The battery provides power to keep the values (such as BIOS congurations, date, and time information)

in the CMOS when the computer is turned off. Replace the battery when the battery voltage drops to a low

level, or the CMOS values may not be accurate or may be lost.

You may clear the CMOS values by removing the battery:

1. Turn off your computer and unplug the power cord.

2. Gently remove the battery from the battery holder and wait for one minute.

(Or use a metal object like a screwdriver to touch the positive and negative

terminals of the battery holder, making them short for 5 seconds.)

3. Replace the battery.

4. Plug in the power cord and restart your computer.

•Always turn off your computer and unplug the power cord before replacing the battery.

•Replace the battery with an equivalent one. Damage to your devices may occur if the battery is

replaced with an incorrect model.

•Contact the place of purchase or local dealer if you are not able to replace the battery by yourself

or uncertain about the battery model.

•When installing the battery, note the orientation of the positive side (+) and the negative side (-)

of the battery (the positive side should face up).

•Used batteries must be handled in accordance with local environmental regulations.

19) CLR_CMOS (Clear CMOS Jumper)

Use this jumper to clear the BIOS conguration and reset the CMOS values to factory defaults. To clear

the CMOS values, use a metal object like a screwdriver to touch the two pins for a few seconds.

•Always turn off your computer and unplug the power cord from the power outlet before clearing

the CMOS values.

•After system restart, go to BIOS Setup to load factory defaults (select Load Optimized Defaults) or

manually congure the BIOS settings (please navigate to the «BIOS Setup» page of GIGABYTE’s

website for more information).

Open: Normal

Short: Clear CMOS Values

— 30 —

20) RST_SW/RST (Reset Button/Reset Jumper)

The reset button (RST_SW) allows users to quickly turn on/off the computer in an open-case environment

when they want to change hardware components or conduct hardware testing. The reset jumper (RST)

can connect to the reset switch on the chassis front panel. Press the reset switch to restart the computer

if the computer freezes and fails to perform a normal restart.

Pin No. Denition

1 Reset

2 GND

The reset button (RST_SW)/rest jumper (RST) provides you with several functions to use. To remap

the button to perform different tasks, please navigate to the «BIOS Setup» page of GIGABYTE’s

website and search for «RST_SW (MULTIKEY)» for more information.

RST_SW

RST

1

RSTRST_SW

21) QFLASH_PLUS (Q-Flash Plus Button)

Q-Flash Plus allows you to update the BIOS when your system is off (S5 shutdown state). Save the latest

BIOS on a USB thumb drive and plug it into the dedicated port, and then you can now ash the BIOS

automatically by simply pressing the Q-Flash Plus button. The QFLED will ash when the BIOS matching

and ashing activities start and will stop ashing when the main BIOS ashing is complete.

To enable the Q-Flash Plus function, please navigate to the «Unique Features» page of GIGABYTE’s

website for more information.

QFLASH_PLUS

QFLED

— 31 —

BIOS (Basic Input and Output System) records hardware parameters of the system in the CMOS on the

motherboard. Its major functions include conducting the Power-On Self-Test (POST) during system startup,

saving system parameters and loading operating system, etc. BIOS includes a BIOS Setup program that allows

the user to modify basic system conguration settings or to activate certain system features.

When the power is turned off, the battery on the motherboard supplies the necessary power to the CMOS to

keep the conguration values in the CMOS.

To access the BIOS Setup program, press the <Delete> key during the POST when the power is turned on.

To upgrade the BIOS, use either the GIGABYTE Q-Flash or @BIOS utility.

•Q-Flash allows the user to quickly and easily upgrade or back up BIOS without entering the operating system.

•@BIOS is a Windows-based utility that searches and downloads the latest version of BIOS from the Internet

and updates the BIOS.

For instructions on using the Q-Flash and @BIOS utilities, please navigate to the «Unique Features» page of

GIGABYTE’s website and search for «BIOS Update Utilities.»

Chapter 3 BIOS Setup

•Because BIOS ashing is potentially risky, if you do not encounter problems using the current

version of BIOS, it is recommended that you not ash the BIOS. To ash the BIOS, do it with

caution. Inadequate BIOS ashing may result in system malfunction.

•It is recommended that you not alter the default settings (unless you need to) to prevent system

instability or other unexpected results. Inadequately altering the settings may result in system’s

failure to boot. If this occurs, try to clear the CMOS values and reset the board to default values.

•Refer to the introductions of the battery/clear CMOS jumper in Chapter 2 or navigate to the «BIOS

Setup» page of GIGABYTE’s website and search for «Load Optimized Defaults» for how to clear

the CMOS values.

Please visit GIGABYTE’s website for details on conguring BIOS Setup.

— 32 —

Startup Screen:

Function Keys:

<DEL>: BIOS SETUPQ-FLASH

Press the <Delete> key to enter BIOS Setup or to access the Q-Flash utility in BIOS Setup.

<F12>: BOOT MENU

Boot Menu allows you to set the rst boot device without entering BIOS Setup. In Boot Menu, use the up

arrow key <h> or the down arrow key <i> to select the rst boot device, then press <Enter> to accept.

The system will boot from the device immediately.

Note: The setting in Boot Menu is effective for one time only. After system restart, the device boot order

will still be based on BIOS Setup settings.

<END>: Q-FLASH

Press the <End> key to access the Q-Flash utility directly without having to enter BIOS Setup rst.

Function Keys

— 33 —

Chapter 4 Installing the Operating System and Drivers

4-1 Operating System Installation

With the correct BIOS settings, you are ready to install the operating system.

If you want to install an operating system on a RAID volume, you need to install the Intel® RST VMD Controller

driver rst during the OS installation process. Refer to the steps below:

Step 1:

Go to GIGABYTE’s website, browse to the motherboard model’s web page, download the Intel SATA Preinstall

driver le on the SupportDownloadSATA RAID/AHCI page, unzip the le and copy the les to your USB

thumb drive.

Step 2:

Boot from the Windows setup disc and perform standard OS installation steps. When the screen requesting you

to load the driver appears, select Browse.

Step 3:

Insert the USB thumb drive and then browse to the location of the driver. When a screen as shown below

appears, select Intel RST VMD Controller 467F and click Next to load the driver and continue the OS installation.

— 34 —

4-2 Drivers Installation

After you install the operating system, a dialog box will appear on the bottom-right corner of the desktop asking

if you want to download and install the drivers and GIGABYTE applications via APP Center. Click Install to

proceed with the installation. (In BIOS Setup, make sure SettingsIO PortsAPP Center Download & Install

CongurationAPPCenterDownload&Install is set to Enabled.)

Please visit GIGABYTE’s website for

more software information.

Please visit GIGABYTE’s website for

more troubleshooting information.

Before the installation, make sure the system is connected to the Internet.

When the End User License Agreement dialog box appears, press <Accept> to install APP Center. On the APP

Center screen, select the drivers and applications you want to install and click Install.

— 35 —

Chapter 5 Appendix

5-1 ConguringaRAIDSet

RAID Levels

Before you begin, please prepare the following items:

This motherboard supports SATA RAID 0, RAID 1, RAID 5, and RAID 10. Prepare the correct number of hard

drives as indicated in the table above before conguring a RAID array.

•SATA hard drives or SSDs. To ensure optimal performance, it is recommended that you use two hard drives

with identical model and capacity.

•Windows setup disc.

•An Internet connected computer.

•A USB thumb drive.

Please visit GIGABYTE’s website for details on conguring a RAID array.

RAID 0 RAID 1 RAID 5 RAID 10

Minimum

Number of Hard

Drives

≥2 2≥3 4

Array Capacity

Number of hard

drives * Size of the

smallest drive

Size of the smallest

drive

(Number of hard

drives -1) * Size of

the smallest drive

(Number of hard

drives/2) * Size of the

smallest drive

Fault Tolerance No Yes Yes Yes

— 36 —

Regulatory Notices

United States of America, Federal Communications Commission Statement

Antenna use:

In order to comply with FCC RF exposure limits, low gain integrated

antennas should be located at a minimum distance of 7.9 inches (20 cm)

or more from the body of all persons.

Explosive Device Proximity Warning

Warning: Do not operate a portable transmitter (such as a wireless network

device) near unshielded blasting caps or in an explosive environment

unless the device has been modied to be qualied for such use.

Antenna Warning

The wireless adapter is not designed for use with high-gain antennas.

Use On Aircraft Caution

Caution: Regulations of the FCC and FAA prohibit airborne operation of

radio-frequency wireless devices because their signals could interfere with

critical aircraft instruments.

Other Wireless Devices

Safety Notices for Other Devices in the Wireless Network: Refer to the

documentation supplied with wireless Ethernet adapters or other devices

in the wireless network.

Canada, Canada-Industry Notice:

This device complies with Industry Canada license-exempt RSS

standard(s). Operation is subject to the following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that

may cause undesired operation of the device.

Cet appareil est conforme aux normes Canada d’Industrie de RSS

permis-exempt. L’utilisation est assujetti aux deux conditions suivantes:

(1) le dispositif ne doit pas produire de brouillage préjudiciable, et

(2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage

susceptible de provoquer un fonctionnement indésirable.

Caution: When using IEEE 802.11a wireless LAN, this product is restricted

to indoor use due to its operation in the 5.15-to 5.25-GHz frequency

range. Industry Canada requires this product to be used indoors for the

frequency range of 5.15 GHz to 5.25 GHz to reduce the potential for

harmful interference to co-channel mobile satellite systems. High power

radar is allocated as the primary user of the 5.25-to 5.35-GHz and 5.65 to

5.85-GHz bands. These radar stations can cause interference with and/or

damage to this device. The maximum allowed antenna gain for use with

this device is 6dBi in order tocomply with the E.I.R.P limit for the 5.25-to

5.35 and 5.725 to 5.85 GHz frequency range in point-to-point operation. To

comply with RF exposure requirements all antennas should be located at a

minimum distance of 20cm, or the minimum separation distance allowed

by the module approval, from the body of all persons.

Attention: l’utilisation d’un réseau sans l IEEE802.11a est restreinte à

une utilisation en intérieur à cause du fonctionnement dansla bande de

fréquence 5.15-5.25 GHz. Industry Canada requiert que ce produit soit

utilisé à l’intérieur des bâtiments pour la bande de fréquence 5.15-5.25

GHz an de réduire les possibilités d’interférences nuisibles aux canaux

co-existants des systèmes de transmission satellites. Les radars de

puissances ont fait l’objet d’une allocation primaire de fréquences dans

les bandes 5.25-5.35 GHz et 5.65-5.85 GHz. Ces stations radar peuvent

créer des interférences avec ce produit et/ou lui être nuisible. Le gain

d’antenne maximum permissible pour une utilisation avec ce produit est de

6 dBi an d’être conforme aux limites de puissance isotropique rayonnée

équivalente (P.I.R.E.) applicable.

dans les bandes 5.25-5.35 GHz et 5.725-5.85 GHz en fonctionnement

point-à-point. Pour se conformer aux conditions d’exposition de RF toutes

les antennes devraient être localisées à une distance minimum de 20

cm, ou la distance de séparation minimum permise par l’approbation du

module, du corps de toutes les personnes.

The FCC with its action in ET Docket 96-8 has adopted a safety standard for human exposure to radio frequency (RF) electromagnetic energy emitted

by FCC certied equipment. The Intel PRO/Wireless 5000 LAN products meet the Human Exposure limits found in OET Bulletin 65, 2001, and ANSI/

IEEE C95.1, 1992. Proper operation of this radio according to the instructions found in this manual will result in exposure substantially below the FCC’s

recommended limits.

The following safety precautions should be observed:

•Do not touch or move antenna while the unit is transmitting or receiving.

•Do not hold any component containing the radio such that the antenna is very close or touching any exposed parts of the body, especially the face

or eyes, while transmitting.

•Do not operate the radio or attempt to transmit data unless the antenna is connected; if not, the radio may be damaged.

•Use in specic environments:

— The use of wireless devices in hazardous locations is limited by the constraints posed by the safety directors of such environments.

— The use of wireless devices on airplanes is governed by the Federal Aviation Administration (FAA).

— The use of wireless devices in hospitals is restricted to the limits set forth by each hospital.

Supplier’s Declaration of Conformity

47 CFR § 2.1077 Compliance Information

Product Name: Motherboard

Trade Name: GIGABYTE

Model Number: B660M GAMING X AX/B660M GAMING X/B660M G X AX DDR4/B660M GAMING X DDR4

Responsible Party – U.S. Contact Information: G.B.T. Inc.

Address: 17358 Railroad street, City Of Industry, CA91748

Tel.: 1-626-854-9338

Internet contact information: https://www.gigabyte.com

FCC Compliance Statement:

This device complies with Part 15 of the FCC Rules, Subpart B, Unintentional Radiators.

Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this

device must accept any interference received, including interference that may cause undesired operation.

— 37 —

European Union (EU) CE Declaration of Conformity

This device complies with the following directives: Electromagnetic

Compatibility Directive 2014/30/EU, Low-voltage Directive 2014/35/EU,

Radio Equipment Directive 2014/53/EU, ErP Directive 2009/125/EC, RoHS

directive (recast) 2011/65/EU & the 2015/863 Statement.

This product has been tested and found to comply with all essential

requirements of the Directives.

European Union (EU) RoHS (recast) Directive 2011/65/EU & the

European Commission Delegated Directive (EU) 2015/863 Statement

GIGABYTE products have not intended to add and safe from hazardous

substances (Cd, Pb, Hg, Cr+6, PBDE, PBB, DEHP, BBP, DBP and DIBP).

The parts and components have been carefully selected to meet RoHS

requirement. Moreover, we at GIGABYTE are continuing our efforts to

develop products that do not use internationally banned toxic chemicals.

European Union (EU) Community Waste Electrical & Electronic

Equipment (WEEE) Directive Statement

GIGABYTE will fulll the national laws as interpreted from the 2012/19/

EU WEEE (Waste Electrical and Electronic Equipment) (recast) directive.

The WEEE Directive species the treatment, collection, recycling and

disposal of electric and electronic devices and their components. Under

the Directive, used equipment must be marked, collected separately, and

disposed of properly.

WEEE Symbol Statement

The symbol shown below is on the product or on its

packaging, which indicates that this product must not be

disposed of with other waste. Instead, the device should be

taken to the waste collection centers for activation of the

treatment, collection, recycling and disposal procedure.

For more information about where you can drop off your waste equipment

for recycling, please contact your local government ofce, your household

waste disposal service or where you purchased the product for details of

environmentally safe recycling.

End of Life Directives-Recycling

The symbol shown below is on the product or on its packaging,

which indicates that this product must not be disposed of with

other waste. Instead, the device should be taken to the waste

collection centers for activation of the treatment, collection,

recycling and disposal procedure.

Déclaration de Conformité aux Directives de l’Union européenne (UE)

Cet appareil portant la marque CE est conforme aux directives de l’UE

suivantes: directive Compatibilité Electromagnétique 2014/30/UE, directive

Basse Tension 2014/35/UE, directive équipements radioélectriques

2014/53/UE, la directive RoHS II 2011/65/UE & la déclaration 2015/863.

La conformité à ces directives est évaluée sur la base des normes

européennes harmonisées applicables.

European Union (EU) CE-Konformitätserklärung

Dieses Produkte mit CE-Kennzeichnung erfüllen folgenden EU-Richtlinien:

EMV-Richtlinie 2014/30/EU, Niederspannungsrichtlinie 2014/35/EU,

Funkanlagen Richtlinie 2014/53/EU, RoHS-Richtlinie 2011/65/EU erfüllt

und die 2015/863 Erklärung.

Die Konformität mit diesen Richtlinien wird unter Verwendung der

entsprechenden Standards zurEuropäischen Normierung beurteilt.

CE declaração de conformidade

Este produto com a marcação CE estão em conformidade com das

seguintes Diretivas UE: Diretiva Baixa Tensão 2014/35/EU; Diretiva

CEM 2014/30/EU; Diretiva RSP 2011/65/UE e a declaração 2015/863.

A conformidade com estas diretivas é vericada utilizando as normas

europeias harmonizadas.

CE Declaración de conformidad

Este producto que llevan la marca CE cumplen con las siguientes

Directivas de la Unión Europea: Directiva EMC 2014/30/EU, Directiva de

bajo voltaje 2014/35/EU, Directiva de equipamentos de rádio 2014/53/EU,

Directiva RoHS 2011/65/EU y la Declaración 2015/863.

El cumplimiento de estas directivas se evalúa mediante las normas

europeas armonizadas.

CE Dichiarazione di conformità

I prodotti con il marchio CE sono conformi con una o più delle seguenti

Direttive UE, come applicabile: Direttiva EMC 2014/30/UE, Direttiva sulla

bassa tensione 2014/35/UE, Direttiva di apparecchiature radio 2014/53/

UE, Direttiva RoHS 2011/65/EU e Dichiarazione 2015/863.

La conformità con tali direttive viene valutata utilizzando gli Standard

europei armonizzati applicabili.

DeklaracjazgodnościUEUniiEuropejskiej

Urządzenie jest zgodne z następującymi dyrektywami: Dyrektywa

kompatybilności elektromagnetycznej 2014/30/UE, Dyrektywa

niskonapięciowej 2014/35/UE, Dyrektywa urządzeń radiowych 2014/53/

UE, Dyrektywa RoHS 2011/65/UE i dyrektywa2015/863.

Niniejsze urządzenie zostało poddane testom i stwierdzono jego zgodność

z wymaganiami dyrektywy.

ESProhlášeníoshodě

Toto zařízení splňuje požadavky Směrnice o Elektromagnetické

kompatibilitě 2014/30/EU, Směrnice o Nízkém napětí 2014/35/EU,

Směrnice o rádiových zařízeních 2014/53/EU, Směrnice RoHS 2011/65/

EU a 2015/863.

Tento produkt byl testován a bylo shledáno, že splňuje všechny základní

požadavky směrnic.

EKmegfelelőséginyilatkozata

A termék megfelelnek az alábbi irányelvek és szabványok

követelményeinek, azok a kiállításidőpontjában érvényes, aktuális

változatában: EMC irányelv 2014/30/EU, Kisfeszültségű villamos

berendezésekre vonatkozó irányelv 2014/35/EU, rádióberendezések

irányelv 2014/53/EU, RoHS irányelv 2011/65/EU és 2015/863.

ΔήλωσησυμμόρφωσηςΕΕ

Είναι σε συμμόρφωση με τις διατάξεις των παρακάτω Οδηγιών

της Ευρωπαϊκής Κοινότητας: Οδηγία 2014/30/ΕΕ σχετικά με την

ηλεκτρομαγνητική συμβατότητα, Οοδηγία χαμηλή τάση 2014/35/EU,

Οδηγία 2014/53/ΕΕ σε ραδιοεξοπλισμό, Οδηγία RoHS 2011/65/ΕΕ

και 2015/863.

Η συμμόρφωση με αυτές τις οδηγίες αξιολογείται χρησιμοποιώντας τα

ισχύοντα εναρμονισμένα ευρωπαϊκά πρότυπα.

Under Industry Canada regulations, this radio transmitter may only operate

using an antenna of a type and maximum (or lesser) gain approved for

the transmitter by Industry Canada. To reduce potential radio interference

to other users, the antenna type and its gain should be chosen so that

the equivalent isotropically radiated power (e.i.r.p.) is not more than that

necessary for successful communication.

Conformément à la réglementation d’Industrie Canada, le présent émetteur

radio peut fonctionner avec une antenne d’un type et d’un gain maximal

(ou inférieur) approuvé pour l’émetteur par Industrie Canada. Dans le

but de réduire les risques de brouillage radio électrique à l’intention des

autres utilisateurs, il faut choisir le type d’antenne et son gain de sorte

que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas

l’intensité nécessaire à l’établissement d’une communication satisfaisante.

European Community Radio Equipment Directive Compliance Statement:

This equipment complies with all the requirements and other relevant provisions of Radio Equipment Directive 2014/53/EU.

This equipment is suitable for home and ofce use in all the European Community Member States and EFTA Member States.

The low band 5.15 -5.35 GHz is for indoor use only.

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