Руководство h81m e33

Copyright Notice

The material in this document is the intellectual property of MICRO-STAR INTERNATIONAL. We take every care in the preparation of this document, but no guarantee is given as to the correctness of its contents. Our products are under continual improvement and we reserve the right to make changes without notice.

Trademarks

All trademarks in this manual are properties of their respective owners.

MSI® is registered trademark of Micro-Star Int’l Co.,Ltd.

NVIDIA® is registered trademark of NVIDIA Corporation.

ATI® is registered trademark of AMD Corporation.

AMD® is registered trademarks of AMD Corporation.

Intel® is registered trademarks of Intel Corporation.

Windows® is registered trademarks of Microsoft Corporation.

AMI® is registered trademark of American Megatrends Inc.

Award® is a registered trademark of Phoenix Technologies Ltd.

Sound Blaster® is registered trademark of Creative Technology Ltd.

Realtek® is registered trademark of Realtek Semiconductor Corporation.

JMicron® is registered trademark of JMicron Technology Corporation.

Netware® is registered trademark of Novell, Inc.

Lucid® is trademark of LucidLogix Technologies, Ltd.

VIA® is registered trademark of VIA Technologies, Inc.

ASMedia® is registered trademark of ASMedia Technology Inc.

iPad, iPhone, and iPod are trademarks of Apple Inc.

Qualcomm Atheros and Killer are trademarks of Qualcomm Atheros Inc.

G52-78461X3

FCC -B Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined

by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the measures listed below.

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/television technician for help. Notice 1

The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.

Micro-Star International

MS-7846

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

) this device may not cause harmful interference, and

2)this device must accept any interference received, including interference that may cause undesired operation.

CE Conformity

Hereby, Micro-Star International CO., LTD declares that this device is in compliance with the essential safety requirements and other relevant provisions set out in the European Directive.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment and its antenna should be installed and operated with minimum distance 20 cm between the radiator and your body. This equipment and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter.

European Community Compliance Statement

The equipment complies with the RF Exposure Requirement 1999/519/EC, Council Recommendation of 12 July 1999 on the limitation of exposure of the general public to electromagnetic fields (0–300GHz). This wireless device complies with the R&TTE Directive.

Taiwan Wireless Statements

頻率、加大功率或變更原設計之特性及功能。

無線電通信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機 設備之干擾。

:

Japan VCCI Class B Statement

B

VCCIB

Korea Warning Statements

Chemical Substances Information

In compliance with chemical substances regulations, such as the EU REACH Regulation (Regulation EC No. 1907/2006 of the European Parliament and the Council), MSI provides the information of chemical substances in products at:

http://www.msi.com/html/popup/csr/evmtprtt_pcm.html

< >

■* (PCB) IC

■: SJ/T113632006

■: SJ/T113632006 EU RoHS

■<

> EPUP (Environmental Protection Use Period)

■EPUP -(SJ/Z 11388-2009) EPUP ,

WEEE Statement

WEEE (Waste Electrical and Electronic Equipment)

ENGLISH

To protect the global environment and as an environmentalist, MSI must remind you that…

Under the European Union (“EU”) Directive on Waste Electrical and

Electronic Equipment, Directive 2002/96/EC, which takes effect on August 13, 2005, products of “electrical and electronic equipment” cannot be discarded as municipal wastes anymore, and manufacturers of covered electronic equipment will be obligated to take back such products at the end of their useful life. MSI will comply with the product take back requirements at the end of life of MSI-branded products that are sold into the EU. You can return these products to local collection points.

DEUTSCH

Hinweis von MSI zur Erhaltung und Schutz unserer Umwelt

Gemäß der Richtlinie 2002/96/EG über Elektround Elektronik-Altgeräte dürfen Elektround Elektronik-Altgeräte nicht mehr als kommunale Abfälle entsorgt werden. MSI hat europaweit verschiedene Sammelund Recyclingunternehmen beauftragt, die in die Europäische Union in Verkehr gebrachten Produkte, am Ende seines Lebenszyklus zurückzunehmen. Bitte entsorgen Sie dieses Produkt zum gegebenen Zeitpunkt ausschliesslich an einer lokalen Altgerätesammelstelle in Ihrer Nähe.

FRANÇAIS

En tant qu’écologiste et afin de protéger l’environnement, MSI tient à rappeler ceci…

Au sujet de la directive européenne (EU) relative aux déchets des équipement électriques et électroniques, directive 2002/96/EC, prenant effet le 13 août 2005, que les produits électriques et électroniques ne peuvent être déposés dans les décharges ou tout simplement mis à la poubelle. Les fabricants de ces équipements seront obligés de récupérer certains produits en fin de vie. MSI prendra en compte cette exigence relative au retour des produits en fin de vie au sein de la communauté européenne. Par conséquent vous pouvez retourner localement ces matériels dans les points de collecte.

РУССКИЙ

Компания MSI предпринимает активные действия по защите окружающей среды, поэтому напоминаем вам, что….

В соответствии с директивой Европейского Союза (ЕС) по предотвращению загрязнения окружающей среды использованным электрическим и электронным оборудованием (директива WEEE 2002/96/EC), вступающей в силу 13

августа 2005 года, изделия, относящиеся к электрическому и электронному оборудованию, не могут рассматриваться как бытовой мусор, поэтому производители вышеперечисленного электронного оборудования обязаны принимать его для переработки по окончании срока службы. MSI обязуется соблюдать требования по приему продукции, проданной под маркой MSI на территории EC, в переработку по окончании срока службы. Вы можете вернуть эти изделия в специализированные пункты приема.

ESPAÑOL

MSI como empresa comprometida con la protección del medio ambiente, recomienda:

Bajo la directiva 2002/96/EC de la Unión Europea en materia de desechos y/o equipos electrónicos, con fecha de rigor desde el 13 de agosto de 2005, los productos clasificados como “eléctricos y equipos electrónicos” no pueden ser depositados en los contenedores habituales de su municipio, los fabricantes de equipos electrónicos, están obligados a hacerse cargo de dichos productos al termino de su período de vida. MSI estará comprometido con los términos de recogida de sus productos vendidos en la Unión Europea al final de su periodo de vida. Usted debe depositar estos productos en el punto limpio establecido por el ayuntamiento de su localidad o entregar a una empresa autorizada para la recogida de estos residuos.

NEDERLANDS

Om het milieu te beschermen, wil MSI u eraan herinneren dat….

De richtlijn van de Europese Unie (EU) met betrekking tot Vervuiling van Electrische en Electronische producten (2002/96/EC), die op 13 Augustus 2005 in zal gaan kunnen niet meer beschouwd worden als vervuiling. Fabrikanten van dit soort producten worden verplicht om producten retour te nemen aan het eind van hun levenscyclus. MSI zal overeenkomstig de richtlijn handelen voor de producten

die de merknaam MSI dragen en verkocht zijn in de EU. Deze goederen kunnen geretourneerd worden op lokale inzamelingspunten.

SRPSKI

Da bi zaštitili prirodnu sredinu, i kao preduzeće koje vodi računa o okolini i prirodnoj sredini, MSI mora da vas podesti da…

Po Direktivi Evropske unije (“EU”) o odbačenoj ekektronskoj i električnoj opremi, Direktiva 2002/96/EC, koja stupa na snagu od 13. Avgusta 2005, proizvodi koji spadaju pod “elektronsku i električnu opremu” ne mogu više biti odbačeni kao običan otpad i proizvođači ove opreme biće prinuđeni da uzmu natrag ove proizvode na kraju njihovog uobičajenog veka trajanja. MSI će poštovati zahtev o preuzimanju ovakvih proizvoda kojima je istekao vek trajanja, koji imaju MSI oznaku i koji su prodati u EU. Ove proizvode možete vratiti na lokalnim mestima za prikupljanje.

POLSKI

Aby chronić nasze środowisko naturalne oraz jako firma dbająca o ekologię, MSI przypomina, że…

Zgodnie z Dyrektywą Unii Europejskiej (“UE”) dotyczącą odpadów produktów elektrycznych i elektronicznych (Dyrektywa 2002/96/EC), która wchodzi w życie 13 sierpnia 2005, tzw. “produkty oraz wyposażenie elektryczne i elektroniczne “ nie mogą być traktowane jako śmieci komunalne, tak więc producenci tych produktów będą zobowiązani do odbierania ich w momencie gdy produkt jest wycofywany z użycia. MSI wypełni wymagania UE, przyjmując produkty (sprzedawane na terenie Unii Europejskiej) wycofywane z użycia. Produkty MSI będzie można zwracać w wyznaczonych punktach zbiorczych.

TÜRKÇE

Çevreci özelliğiyle bilinen MSI dünyada çevreyi korumak için hatırlatır:

Avrupa Birliği (AB) Kararnamesi Elektrik ve Elektronik Malzeme Atığı, 2002/96/EC Kararnamesi altında 13 Ağustos 2005 tarihinden itibaren geçerli olmak üzere, elektrikli ve elektronik malzemeler diğer atıklar gibi çöpe atılamayacak ve bu elektonik cihazların üreticileri, cihazların kullanım süreleri bittikten sonra ürünleri geri toplamakla yükümlü olacaktır. Avrupa Birliği’ne satılan MSI markalı ürünlerin kullanım süreleri bittiğinde MSI ürünlerin geri alınması isteği ile işbirliği içerisinde olacaktır. Ürünlerinizi yerel toplama noktalarına bırakabilirsiniz.

ČESKY

Záleží nám na ochraně životního prostředí — společnost MSI upozorňuje…

Podle směrnice Evropské unie (“EU”) o likvidaci elektrických a elektronických výrobků 2002/96/EC platné od 13. srpna 2005 je zakázáno likvidovat “elektrické a elektronické výrobky” v běžném komunálním odpadu a výrobci elektronických

výrobků, na které se tato směrnice vztahuje, budou povinni odebírat takové výrobky zpět po skončení jejich životnosti. Společnost MSI splní požadavky na odebírání výrobků značky MSI, prodávaných v zemích EU, po skončení jejich životnosti. Tyto výrobky můžete odevzdat v místních sběrnách.

MAGYAR

Annak érdekében, hogy környezetünket megvédjük, illetve környezetvédőként fellépve az MSI emlékezteti Önt, hogy …

Az Európai Unió („EU”) 2005. augusztus 13-án hatályba lépő, az elektromos és elektronikus berendezések hulladékairól szóló 2002/96/EK irányelve szerint az elektromos és elektronikus berendezések többé nem kezelhetőek lakossági hulladékként, és az ilyen elektronikus berendezések gyártói kötelessé válnak az ilyen termékek visszavételére azok hasznos élettartama végén. Az MSI betartja a termékvisszavétellel kapcsolatos követelményeket az MSI márkanév alatt az EU-n belül értékesített termékek esetében, azok élettartamának végén. Az ilyen termékeket a legközelebbi gyűjtőhelyre viheti.

ITALIANO

Per proteggere l’ambiente, MSI, da sempre amica della natura, ti ricorda che….

In base alla Direttiva dell’Unione Europea (EU) sullo Smaltimento dei Materiali Elettrici ed Elettronici, Direttiva 2002/96/EC in vigore dal 13 Agosto 2005, prodotti appartenenti alla categoria dei Materiali Elettrici ed Elettronici non possono più essere eliminati come rifiuti municipali: i produttori di detti materiali saranno obbligati a ritirare ogni prodotto alla fine del suo ciclo di vita. MSI si adeguerà a tale Direttiva ritirando tutti i prodotti marchiati MSI che sono stati venduti all’interno dell’Unione Europea alla fine del loro ciclo di vita. È possibile portare i prodotti nel più vicino punto di raccolta

Contents

English 11

Motherboard Specifications 12 Optional Specifications 14 Back Panel 15 CPU & Heatsink Installation 16 Memory Installation 18 Internal Connectors 19 BIOS Setup 25

33

343637 CPU 384041 BIOS 47

Français 55

Spécifications 56 Spécifications en option 58 Panneau Arrière 59 Installation du CPU et son ventilateur 60 Installation de mémoire 62 Connecteurs internes 63 Configuration BIOS 69

Deutsch 77

Spezifikationen 78 Optionale Spezifikationen 80 Rücktafel-Übersicht 81 CPU & Kühlkörper Einbau 82 Speicher 84 Interne Anschlüsse 85 BIOS Setup 91

Русский 99

Характеристики материнской платы 100 Дополнительные характеристики 102 Задняя панель 103 Установка ЦП и радиатора 104 Установка памяти 106 Внутренние разъемы 107 Настройка BIOS 113

121

122124125 CPU & 126128129 BIOS Setup 135

141

142145CPU 146148149 BIOS 155

161

162164 I/O 165 CPU 166168169 BIOS 175

English

Thank you for choosing the H81M-P33 V2/ H81M-E33 V2/ B85M-P33 V2/ B85M-E33 V2 Series (MS-7846 v2.X) Micro-ATX motherboard. The H81M-P33 V2/ H81M-E33 V2/ B85M-P33 V2/ B85M-E33 V2 Series motherboards are based on Intel H81/ B85 chipset for optimal system efficiency. Designed to fit the advanced Intel LGA1150 processor, the H81M-P33 V2/ H81M-E33 V2/ B85M-P33 V2/ B85M-E33 V2 Series motherboards deliver a high performance and professional desktop platform solution.

Layout

Motherboard Specifications

■1x HDMI port (optional), supporting a maximum resolution of 4096×2160@24Hz, 24bpp/ 2560×1600@60Hz, 24bpp/ 1920×1080@60Hz, 36bpp

■1x DVI-D port (optional), supporting a maximum resolution of 1920×1200 @ 60Hz, 24bpp

—2x SATA 6Gb/s ports (SATA1~2)

—2x SATA 3Gb/s ports (SATA3~4)

—Supports Intel Rapid Start Technology (optional)*

—Supports Intel Smart Connect Technology

* Supports Intel Core processors on Windows 7 and Windows 8

—4x USB 3.0 ports (2 ports on the back panel, 2 ports available through the internal USB connector*)

—8x USB 2.0 ports (4 ports on the back panel, 4 ports

available through the internal USB connectors)

* H81M-P33 V2/ H81M-E33 V2 uses NEC uPD720202 USB 3.0 controller for the internal USB 3.0 connector.

■2x SATA 6Gb/s connectors

■2x SATA 3Gb/s connectors

■2x USB 2.0 connectors (supports additional 4 USB 2.0 ports)

■1x USB 3.0 connector (supports additional 2 USB 3.0 ports)

■1x 4-pin CPU fan connector

■1x 4-pin system fan connector

■1x 3-pin system fan connector

■1x Front panel audio connector

■1x Serial port connector

■1x TPM connector

■2x System panel connectors

■1x Chassis Intrusion connector

■1x Clear CMOS jumper

For the latest information about CPU, please visit

http://www.msi.com/service/cpu-support/

For more information on compatible components, please visit http://www.msi.com/service/test-report/

Optional Specifications

CPU & Heatsink Installation

When installing a CPU, always remember to install a CPU heatsink. A CPU heatsink is necessary to prevent overheating and maintain system stability. Follow the steps below to ensure correct CPU and heatsink installation. Wrong installation can damage both the CPU and the motherboard.

Video Demonstration

Watch the video to learn how to install CPU & heatsink. at the address below.

http://youtu.be/bf5La099urI

1.Push the load lever down to unclip it and lift to the fully open position.

2.The load plate will automatically lift up as the load lever is pushed to the fully open position.

Important

Do not touch the socket contacts or the bottom of the CPU.

3.Align the notches with the socket alignment keys. Lower the CPU straight down, without tilting or sliding the CPU in the socket. Inspect the CPU to check if it is properly seated in the socket.

4.Close and slide the load plate under the retention knob. Close and engage the load lever.

CPU notches

Alignment Key

5.When you press down the load lever the PnP cap will automatically pop up from the CPU socket. Do not discard the PnP cap. Always replace the PnP cap if the CPU is removed from the socket.

6.Evenly spread a thin layer of thermal paste (or thermal tape) on the top of the CPU. This will help in heat dissipation and prevent CPU overheating.

Thermal paste

Memory Installation

Video Demonstration

Watch the video to learn how to install memories at the address below. http://youtu.be/76yLtJaKlCQ

1

2

3

Important

•DDR3 memory modules are not interchangeable with DDR2, and the DDR3 standard is not backward compatible. Always install DDR3 memory modules in DDR3 DIMM slots.

•To ensure system stability, memory modules must be of the same type and density in Dual-Channel mode.

SATA1~4: SATA Connectors

This connector is a high-speed SATA interface port. Each connector can connect to one SATA device. SATA devices include disk drives (HDD), solid state drives (SSD), and optical drives (CD/ DVD/ Blu-Ray).

Video Demonstration

Watch the video to learn how to Install SATA HDD. http://youtu.be/RZsMpqxythc

SATA2

SATA1

Important

•Many SATA devices also need a power cable from the power supply. Such devices include disk drives (HDD), solid state drives (SSD), and optical drives (CD / DVD / Blu-Ray). Please refer to the device’s manual for further information.

•Many computer cases also require that large SATA devices, such as HDDs, SSDs, and optical drives, be screwed down into the case. Refer to the manual that came with your computer case or your SATA device for further installation instructions.

•Please do not fold the SATA cable at a 90-degree angle. Data loss may result during transmission otherwise.

•SATA cables have identical plugs on either sides of the cable. However, it is recommended that the flat connector be connected to the motherboard for space saving purposes.

JCI1: Chassis Intrusion Connector

This connector connects to the chassis intrusion switch cable. If the computer case is opened, the chassis intrusion mechanism will be activated. The system will record this intrusion and a warning message will flash on screen. To clear the warning, you must enter the BIOS utility and clear the record.

JBAT1: Clear CMOS Jumper

There is CMOS RAM onboard that is external powered from a battery located on the motherboard to save system configuration data. With the CMOS RAM, the system can automatically boot into the operating system (OS) every time it is turned on. If you want to clear the system configuration, set the jumpers to clear the CMOS RAM.

Important

You can clear the CMOS RAM by shorting this jumper while the system is off. Afterwards, open the jumper . Do not clear the CMOS RAM while the system is on because it will damage the motherboard.

PCI_E1~3: PCIe Expansion Slots

The PCIe slot supports the PCIe interface expansion card.

PCIe x16 Slot

PCIe x1 Slot

Important

When adding or removing expansion cards, always turn off the power supply and unplug the power supply power cable from the power outlet. Read the expansion card’s documentation to check for any necessary additional hardware or software changes.

BIOS Setup

The default settings offer the optimal performance for system stability in normal conditions. You may need to run the Setup program when:

■An error message appears on the screen during the system booting up, and requests you to run SETUP.

■You want to change the default settings for customized features.

Important

•Please load the default settings to restore the optimal system performance and stability if the system becomes unstable after changing BIOS settings. Select the «Restore Defaults» and press <Enter> in BIOS to load the default settings.

•If you are unfamiliar with the BIOS settings, we recommend that you keep the default settings to avoid possible system damage or failure booting due to inappropriate BIOS configuration.

Entering BIOS Setup

Power on the computer and the system will start the Power On Self Test (POST) process. When the message below appears on the screen, please <DEL> key to enter BIOS:

Press DEL key to enter Setup Menu, F11 to enter Boot Menu

If the message disappears before you respond and you still need to enter BIOS, restart the system by turning the computer OFF then back ON or pressing the RESET button. You may also restart the system by simultaneously pressing <Ctrl>, <Alt>, and <Delete> keys.

MSI additionally provides two methods to enter the BIOS setup. You can click the “GO2BIOS” tab on “MSI Fast Boot” utility screen or press the physical “GO2BIOS» button (optional) on the motherboard to enable the system going to BIOS setup directly at next boot.

Click «GO2BIOS» tab on «MSI Fast

Boot» utility screen.

Important

Please be sure to install the “MSI Fast Boot” utility before using it to enter the BIOS setup.

Overview

After entering BIOS, the following screen is displayed.

Menu display

OC Menu

Current CPU/ DRAM/ Ring Frequency

These items show the current frequencies of installed CPU, Memory and Ring. Read-only.

CPU Ratio Mode [Auto]

Selects the CPU Ratio operating mode.

Adjust CPU Ratio [Auto]

Sets the CPU ratio that is used to determine CPU clock speed. This item can only be changed if the processor supports this function.

Adjusted CPU Frequency

Shows the adjusted CPU frequency. Read-only.

EIST [Enabled]

Enables or disables the Enhanced Intel® SpeedStep Technology.

IntelTurbo Boost [Enabled]

Enables or disables the Intel® Turbo Boost. This item appears when the installed CPU supports this function.

Adjust Ring Ratio [Auto]

Sets the ring ratio. The valid value range depends on the installed CPU.

Adjusted Ring Frequency

Shows the adjusted Ring frequency. Read-only.

Adjust GT Ratio [Auto]

Sets the integrated graphics ratio. The valid value range depends on the installed CPU.

Adjusted GT Frequency

Shows the adjusted integrated graphics frequency. Read-only.

DRAM Frequency [Auto]

Sets the DRAM frequency. Please note the overclocking behavior is not guaranteed.

Adjusted DRAM Frequency

Shows the adjusted DRAM frequency. Read-only.

DRAM Timing Mode [Auto] Selects the memory timing mode.

Advanced DRAM Configuration

Press <Enter> to enter the sub-menu. This sub-menu will be activated after setting [Link] or [Unlink] in “DRAM Timing Mode”. User can set the memory timing for each memory channel. The system may become unstable or unbootable after changing memory timing. If it occurs, please clear the CMOS data and restore the default settings. (Refer to the Clear CMOS jumper/ button section to clear the CMOS data, and enter the BIOS to load the default settings.)

Memory Fast Boot [Auto]

Enables or disables the initiation and training for memory every booting.

DRAM Voltage [Auto]

Sets the memory voltage. If set to «Auto», BIOS will set memory voltage automatically or you can set it manually.

Spread Spectrum

This function reduces the EMI (Electromagnetic Interference) generated by modulating clock generator pulses.

Important

•If you do not have any EMI problem, leave the setting at [Disabled] for optimal system stability and performance. But if you are plagued by EMI, select the value of Spread Spectrum for EMI reduction.

•The greater the Spread Spectrum value is, the greater the EMI is reduced, and the system will become less stable. For the most suitable Spread Spectrum value, please consult your local EMI regulation.

•Remember to disable Spread Spectrum if you are overclocking because even a slight jitter can introduce a temporary boost in clock speed which may just cause your overclocked processor to lock up.

CPU Features

Press <Enter> to enter the sub-menu.

Hyper-ThreadingTechnology [Enabled]

The processor uses Hyper-Threading technology to increase transaction rates and reduces end-user response times. Intel Hyper-Threading technology treats the multi cores inside the processor as multi logical processors that can execute instructions simultaneously. In this way, the system performance is highly improved.

Active Processor Cores [All]

This item allows you to select the number of active processor cores.

Limit CPUID Maximum [Disabled]

Enables or disables the extended CPUID value.

Execute Disable Bit [Enabled]

Intel’s Execute Disable Bit functionality can prevent certain classes of malicious “buffer overflow” attacks where worms attempt to execute code to damage the system. It is recommended that keeps this item enabled always.

Intel Virtualization Tech [Enabled]

Enables or disables Intel Virtualization technology.

Hardware Prefetcher [Enabled]

Enables or disables the hardware prefetcher (MLC Streamer prefetcher).

Adjacent Cache Line Prefetch [Enabled]

Enables or disables the CPU hardware prefetcher (MLC Spatial prefetcher).

CPU AES Instructions [Enabled]

Enables or disables the CPU AES (Advanced Encryption Standard-New Instructions) support. This item appears when a CPU supports this function.

Intel Adaptive Thermal Monitor [Enabled]

Enables or disables the Intel adaptive thermal monitor function to protect the CPU from overheating.

Intel C-State [Auto]

C-state is a processor power management technology defined by ACPI.

C1E Support [Disabled]

Enables or disables the C1E function for power-saving in halt state. This item appears when «Intel C-State» is enabled.

Package C State limit [Auto]

This item allows you to select a CPU C-state mode for power-saving when system is idle. This item appears when «Intel C-State» is enabled.

LakeTiny Feature [Disabled]

Enables or disables Intel Lake Tiny feature with iRST for SSD. This item appears when a installed CPU supports this function and «Intel C-State» is enabled.